Unicote Halco
Lead Free Horizontal Solder Leveling Equipment
HSL-175
- Economical Horizontal In-Line Leveling
- RoHS Compliant Lead Free Solder
- Compatible with all circuit processing from flexible to rigid up to .250" thick
- Re-solder routed inventory to a Lead Free surface
- Preheat through Cool Down, maintain a consistent thermal profile with minimal thermal shock
- Strict process standards allow surface mount pads to be uniformly coated to a thickness controlled within a 3 sigma standard deviation
Unicote Finishes
Lead Free Horizontal Solder Leveling Service
HSL-175
- RoHS Compliant Lead Free Solder
- Proven Horizontal Application Process for both Rigid and Flex Materials
- Delivers Horizontal Benefit of Consistent
- Finish Thickness
- In-system Preheat Process results in Less Thermal Shock to PCB
- Horizontal processing means No Dwell Time in Solder Pot